Advanced Technology, Precision Manufacturing

Manufacturing Capabilities

We offer comprehensive PCB manufacturing capabilities, from multilayer to special processes.

COMPREHENSIVE MANUFACTURING

1 to 64 Layers — Full PCB Coverage for Your Needs

Upload your Gerber files for instant automated quoting and DFM checks. As fast as 24-hour turnaround. Rigid, flex, rigid-flex, metal core, and HDI boards — from prototype to production, all in one place.

01
1–64 layer rigid PCB fabrication
02
Rigid-flex and flexible circuit boards
03
Metal core (MCPCB) and ceramic substrates
04
HDI / microvia / blind & buried vias
05
Impedance-controlled stack-ups
06
Max copper thickness up to 12 oz

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MANUFACTURING PROCESSES

Complete In-House Process, Quality Under Control

Every step managed in-house for stable lead times and consistent quality — just upload your files and leave the rest to us.

🔬

Inner Layer Imaging

High-resolution LDI exposure for trace/space down to 3/3 mil on inner layers with AOI verification.

🧪

Electroless Copper & Plating

Automated desmear, electroless copper deposition, and electrolytic plating for reliable via barrel filling.

🎨

Solder Mask & Legend

LPI solder mask in multiple colors with UV-cured legend printing for clear component identification.

⚡

Surface Finish

ENIG, HASL, lead-free HASL, OSP, immersion silver, immersion tin, and hard gold plating options.

🔍

Electrical Testing

Flying-probe and fixture-based continuity/hipot testing on 100% of fabricated boards.

📐

CNC Routing & V-Scoring

Precision CNC routing with ±0.1 mm tolerance and V-scoring for panel depanelization.

CORE CAPABILITIES

What We Can Do

24hr

Fastest Prototype Turnaround

Maximum Layer Count

2/2 mil

Finest Trace / Space

99.6%

First-Pass Yield Rate

50K m²

Monthly Production Capacity

IPC-6012

Class 2 & Class 3 Compliant

QUALITY ASSURANCE

Built-In Quality at Every Stage

After upload, our system automatically runs DFM/DRC analysis with instant feedback. Every order is then reviewed by engineers — impedance simulation, microsection analysis, and solderability testing included.

01
Automated DFM/DRC analysis on every order
02
Impedance coupon testing per IPC-TM-650
03
Cross-section microsection analysis
04
Solderability and ionic contamination testing
05
Full traceability from raw material to shipment

View Quality Standards

OUR FACILITY

State-of-the-Art Equipment

Laser drilling machine — CO₂/UV Laser Drilling for Microvias

Copper plating line — Automated Electroless Copper & Plating

Solder mask application — LPI Solder Mask Imaging & Curing

Circuit pattern imaging — LDI Direct Imaging System

Silkscreen printing — Legend / Silkscreen Printing

Electrical testing — Flying Probe Electrical Test

ECLOUD / NEXT STEP

Start Your PCB Project Now

Upload Gerber, get a quote and DFM feedback in minutes.

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PCB Process Capability Chart

Category	Item	Quotation & Engineering Review	Online Instant Quote
Basic Process	Layers	1-64 layers	1-16 layers
	Base Materials	FR-4 Rigid, Aluminum Base, Copper Base, FPC, High-Frequency/Mixed Pressure, HDI, CEM-1, CEM-3, 22F	FR-4 (High TG, Halogen-Free)
	TG Value	130-170	130-170
	Board Thickness	0.4-4.5 mm	0.4-3.0 mm
	Thickness Tolerance	+/-10%	+/-10%
	Outer Layer Copper Thickness	0.5-12 oz	0.5-3 oz
	Inner Layer Copper Thickness	0.5-8 oz	0.5-2 oz
	Dimensions	1020x600 mm	500x500 mm
	HDI	1-5 stages	Not Available
Drilling	Hole Size	0.1-6.5 mm	0.15-0.3+ mm
	Slot Holes	PTH Slot Width >=0.5 mm; NPTH Slot Width >=1.0 mm	Same as Left
	PTH Hole Tolerance	+/-0.075 mm	+/-0.075 mm
	NPTH Hole Tolerance	+/-0.05 mm	+/-0.05 mm
	Half-Holes	Hole Size >=0.5 mm; Pitch >=0.8 mm	Same as Left
	Via Holes	0.15-0.5 mm	0.15-0.5 mm
	Edge Plating	Min. Outline Size 10x10 mm; Board Thickness >=0.6 mm	Same as Left
	Counterbore	Board Thickness >=0.6 mm	Same as Left
Circuit	Min. Line Width/Spacing	2.5-18 mil	3/3 mil
	Line Width Tolerance	+/-20%	+/-20%
	Min. Drill-to-Line Distance	5 mil	5 mil
	Impedance	Requires Impedance Diagram Confirmation	Requires Impedance Diagram Confirmation
Solder Mask	Solder Mask Color	Green, Matte Green, Cool White, Warm White, Black, Matte Black, Red, Yellow, Blue	Same as Left
	Solder Mask Thickness	15+/-10 um	15+/-10 um
	Via Treatment	Via Tenting, Via Opening, Resin Filling, Ink Filling	Via Tenting, Via Opening, Resin/Ink Filling
	Solder Mask Opening	1.5-5 mil	1.5-5 mil
	Min. Solder Mask Bridge	2 mil	2 mil
Legend	Legend Color	White, Black	White, Black
Surface Finish	Surface Finish	HASL (Lead/Lead-Free), ENIG, OSP, Electroplated Nickel Gold, Immersion Silver, Tin Plating	HASL (Lead/Lead-Free), ENIG, OSP, Immersion Silver, Tin Plating
	Gold Thickness (ENIG)	1-10 microinches	1-5 microinches
Panelization	V-CUT Panelization	Supported	Supported
	Stamp Hole Panelization	Supported	Supported
	CNC Routing	Supported	Supported

Notes

Quotation & Engineering Review: Suitable for complex processes, special requirements, or high-precision PCB boards, providing full engineering support
Online Instant Quote: Suitable for standard process quick-turn prototypes with automated quoting and order processing
Same as Left: Indicates same specification as left column
All specifications subject to change without notice, final determination subject to engineering review

For more detailed information or special requirements, please contact our engineering team via email.

1 to 64 Layers — Full PCB Coverage for Your Needs

1–64 layer rigid PCB fabrication

Rigid-flex and flexible circuit boards

Metal core (MCPCB) and ceramic substrates

HDI / microvia / blind & buried vias

Impedance-controlled stack-ups

Max copper thickness up to 12 oz

Request a Quote

Built-In Quality at Every Stage

Automated DFM/DRC analysis on every order

Impedance coupon testing per IPC-TM-650

Cross-section microsection analysis

Solderability and ionic contamination testing

Full traceability from raw material to shipment

View Quality Standards

PCB Process Capability Chart