Optically inspects PCB circuit patterns to identify suspected opens, shorts, nicks and residual copper for review and process follow-up.
Equipment
Optically inspects PCB circuit patterns to identify suspected opens, shorts, nicks and residual copper for review and process follow-up.
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Inspects circuit patterns after formation and locates suspected defects for verification. Inspection settings are adapted to the material, copper surface and feature dimensions, complementing final electrical testing.
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Applies photosensitive dry film to PCB copper surfaces under controlled temperature, pressure and transport conditions, preparing panels for exposure and circuit pattern transfer.
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Directly images digital circuit data onto photosensitive dry film, using panel alignment and dimensional compensation for inner- and outer-layer PCB exposure.
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