4-16 layer multi-layer PCB with blind/buried vias and impedance control
4-16 layer multi-layer PCB with blind/buried vias and impedance control
Manufactured with X-Ray inspection equipment for quality analysis, ensuring precise layer-to-layer alignment. Supports blind vias, buried vias, via-in-pad, and other special processes. Suitable for servers, networking equipment, industrial control, and other high-end applications.
