Automatically spray-coats solder mask onto PCB surfaces and integrates drying to accommodate different circuit densities and surface profiles.
Equipment
Automatically spray-coats solder mask onto PCB surfaces and integrates drying to accommodate different circuit densities and surface profiles.
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Applies solder mask and performs preliminary drying. Process control covers coating coverage, thickness, ink accumulation near holes, bubbles and panel handling before exposure and development.
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Applies photosensitive dry film to PCB copper surfaces under controlled temperature, pressure and transport conditions, preparing panels for exposure and circuit pattern transfer.
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Directly images digital circuit data onto photosensitive dry film, using panel alignment and dimensional compensation for inner- and outer-layer PCB exposure.
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Optically inspects PCB circuit patterns to identify suspected opens, shorts, nicks and residual copper for review and process follow-up.
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