Integrates developing, etching and stripping to form copper circuitry from resist patterns, with chemistry and transport controls supporting process consistency.
Equipment
Integrates developing, etching and stripping to form copper circuitry from resist patterns, with chemistry and transport controls supporting process consistency.
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Configured for inner- or outer-layer processing and the specified copper thickness. Key controls include chemistry condition, spray settings, conveyor speed, rinsing and etched conductor dimensions.
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Applies photosensitive dry film to PCB copper surfaces under controlled temperature, pressure and transport conditions, preparing panels for exposure and circuit pattern transfer.
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Directly images digital circuit data onto photosensitive dry film, using panel alignment and dimensional compensation for inner- and outer-layer PCB exposure.
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Optically inspects PCB circuit patterns to identify suspected opens, shorts, nicks and residual copper for review and process follow-up.
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