Provides a controlled hot-air environment for PCB drying and curing, with temperature and time profiles selected for the materials and inks.
Equipment
Provides a controlled hot-air environment for PCB drying and curing, with temperature and time profiles selected for the materials and inks.
Our team will help you pick the right equipment
Performs board baking according to process requirements. Controls include temperature uniformity, loading arrangement, heating profiles and records, with attention to actual board temperatures.
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Applies photosensitive dry film to PCB copper surfaces under controlled temperature, pressure and transport conditions, preparing panels for exposure and circuit pattern transfer.
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Directly images digital circuit data onto photosensitive dry film, using panel alignment and dimensional compensation for inner- and outer-layer PCB exposure.
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Optically inspects PCB circuit patterns to identify suspected opens, shorts, nicks and residual copper for review and process follow-up.
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