DFM Practical Case 24: PCB Manufacturing Inner Layer Patterning Process: How to Resolve Residual Copper Short Circuits?
The rapid iteration of AI computing power and consumer electronics is driving PCB manufacturing toward higher layer counts, High-Density Interconnects (HDI), and increasingly lighter, thinner, and smaller form factors. Consequently, inner layer trace levels have gradually scaled down from the conventional 100/100μm to 85/85, 75/75, 60/60, 50/50, and even 40/40μm, exponentially increasing both circuit complexity and manufacturing difficulty.
Amidst these challenges, "inner layer residual copper short circuits" have emerged as a core pain point restricting yield rates. So, how can this be improved?
In this article, we won't discuss anything else; we will focus solely on the issue of inner layer residual copper shorts. We will break down the process steps of inner layer pattern transfer in detail and, combined with on-site practical experience, propose specific, actionable improvement countermeasures to provide you with a clear direction and logic for improvement.
