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eCloud PCB, a Taiwan-based professional team, focuses on fast PCB prototyping and small-batch manufacturing. Backed by rich engineering experience, manufacturing resources and cloud tech, our engineer-oriented online platform supports instant upload, real-time quoting and order tracking for multi-layer boards, HDI and special processes, helping customers speed up R&D and product validation efficiently.

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Insights

Explore the latest trends in PCB design and manufacturing

Insights

Explore the latest trends in PCB design and manufacturing

Essential Knowledge for R&D: How Much Current Can a PCB Trace Carry? Why “1 A per 1 mm” Is Not a Design Rule

“Is a 1 mm trace wide enough for 1 A?” This is a common PCB power-routing question, but it has no universally correct answer without defined operating conditions. A 1 mm trace made with 1 oz copper does not behave the same as one made with 2 oz copper. Its resistance, voltage drop, and temperature rise also change depending on whether it is on an external or internal layer and whether it is 10 mm or 100 mm long. PCB current-carrying capacity is therefore not a simple conversion between current and trace width. It is an electrical, thermal, and manufacturing problem.

8/23/2026

Course

Essential Knowledge for R&D: PCB Positive and Negative Artwork Are Not Two Fixed Etching Processes

PCB engineers frequently encounter the terms “positive” and “negative,” but these terms can describe different concepts across design software, CAM systems, and PCB fabricators. They may refer to Gerber image polarity, the light-and-dark relationship on a physical phototool, or the different imaging requirements of inner-layer print-and-etch and outer-layer pattern plating. Treating the subject as simply “positive for fine lines and negative for large copper areas” mixes image polarity, photoresist behavior, and the actual manufacturing route. The first questions should instead be: Which copper must remain? What photoresist is being used? Which areas remain after development? Is the next operation direct etching, or plating followed by etching?

8/21/2026

Course

CoWoS Is Scaling Toward 14 Reticle Sizes: What Should PCB and System Designers Watch?

As AI accelerators integrate more compute dies and high-bandwidth memory (HBM), advanced packages continue to grow in size. At its 2026 Technology Symposium, TSMC stated that it was producing CoWoS at 5.5 times reticle size and planned to begin production of a 14-reticle-size version in 2028. The architecture is expected to accommodate approximately ten large compute dies and twenty HBM stacks. Versions larger than 14 reticle sizes are planned for 2029. This development is about more than making the package larger. As a package becomes a complete computing system, PCB, power, thermal, and mechanical design must be coordinated earlier.

8/21/2026

Course

Will Glass Substrates Replace PCBs? Three Things the Industry Should Understand in the AI Advanced-Packaging Era

As AI, high-performance computing (HPC), and multi-die integration continue to drive interconnect density upward, glass substrates have become an important topic in advanced packaging. The market, however, is also filled with claims that can easily create confusion—for example, that glass will soon replace conventional PCBs, that certain AI processors have already moved entirely to glass, or that a specific year will mark the beginning of immediate mass adoption. For PCB manufacturers, the more useful questions are what glass substrates are designed to replace, which engineering problems they address, and how they may change customer requirements. The short answer is that glass substrates are not expected to directly replace conventional FR-4 multilayer PCBs in the near term. Their primary target is the organic core substrate and selected interposer functions inside advanced semiconductor packages. This is a different layer from server motherboards, control boards, and conventional HDI PCBs.

8/20/2026

Course

Current Affairs: Another AI Server Component Shortage? Examining PCB Stockpiling Strategies for the Second Half of 2026 Through International Copper Price Fluctuations

Examining PCB Stockpiling Strategies for the Second Half of 2026 Through International Copper Price Fluctuations

8/19/2026

Course

Design Practice: 400 Components on One Schematic? How Modular PCB Design Turns Complexity Into Reusable Blocks

This article moves from the definition of modular design and the trade-off against flat design, all the way through to panelization, DFM, and manufacturing handover.

8/16/2026