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Blog: Current Events: A Preview of Computex 2026: New PCB Specifications and Technological Paradigm Shifts Quietly Being Adopted by Major System Manufacturers

As Computex 2026 draws near, the global semiconductor and systems integration industries are at a critical technological turning point. For Taiwan’s R&D engineers and design teams, 2026 is not merely a year of hardware upgrades; it marks the dawn of a new era in which AI computing shifts from simple chip competition to “rack-scale” system integration. Driven by the demand for AI servers and high-performance computing (HPC), the design paradigm for printed circuit boards (PCBs) is undergoing an unprecedented and dramatic transformation. This transformation encompasses the introduction of ultra-low-loss materials, breakthroughs in ultra-high-layer-count processes, thermal management challenges in three-dimensional spaces, and signal integrity requirements under new high-speed protocols. The PCB market is projected to reach a record high of $105.2 billion in 2026, driven primarily by these advanced technical specifications that system manufacturers have been “quietly adopting.”