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eCloud PCB, a Taiwan-based professional team, focuses on fast PCB prototyping and small-batch manufacturing. Backed by rich engineering experience, manufacturing resources and cloud tech, our engineer-oriented online platform supports instant upload, real-time quoting and order tracking for multi-layer boards, HDI and special processes, helping customers speed up R&D and product validation efficiently.

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Insights

Explore the latest trends in PCB design and manufacturing

Insights

Explore the latest trends in PCB design and manufacturing

Industry Outlook: CoWoS, CoPoS, and CoWoP Explained—from Interposers to Advanced PCBs

As AI processors integrate more logic dies and high-bandwidth memory (HBM), the advanced-packaging challenge is shifting from whether heterogeneous integration is possible to whether packages can become larger, interconnects can become shorter, and acceptable cost and yield can still be maintained. CoWoS, CoPoS, and CoWoP may sound similar, but they address different constraints. CoWoS is a 2.5D packaging platform already in volume production. CoPoS explores moving selected processes from circular wafers to rectangular panels. CoWoP goes further by investigating whether an advanced platform PCB can assume some of the functions traditionally handled by a package substrate. For PCB engineers, the key issue is not the acronyms themselves. It is the changing boundary between semiconductor packaging and the system board.

8/28/2026

Course

Industry Outlook: When Deliverability Matters More Than Price—What Is Happening in the PCB Supply Chain?

The question PCB buyers ask most often is gradually changing. Instead of asking, “Can the price be reduced further?” more teams now want to know whether materials are available and whether the delivery date can be confirmed. This shift deserves attention from R&D, procurement, and project management teams. Cost pressure in the 2026 PCB market is not simply another short-term price cycle. It reflects the combined impact of AI server demand, limited capacity for critical materials, yield constraints on advanced products, and suppliers reallocating capacity toward higher-value applications. This does not mean that every PCB segment is experiencing a universal shortage. The tightest areas are advanced copper-clad laminates (CCLs), specialty fiberglass cloth, and manufacturing resources capable of supporting high-speed, high-layer-count, and large-format boards. Understanding this structural imbalance is more useful than attempting to predict the exact size of the next price increase.

8/24/2026

Course

Industry Outlook: Why Do PCB Raw Materials Affect Quotations? Understanding Copper Foil, CCL, and High-Speed Laminates

Why can the quotation for a PCB change when the dimensions and order quantity appear to be the same? Why may the price movement of a standard multilayer board remain limited while a high-layer-count, heavy-copper, or low-loss board changes more noticeably? The answer is not simply that the fabricator has raised its price, nor can it be explained by copper prices alone. A PCB quotation reflects raw materials, laminate specifications, manufacturing complexity, material utilization, yield risk, and supply conditions. For R&D engineers and product managers, understanding which design decisions amplify these factors is more useful than trying to predict the next price movement.

8/24/2026

Course

Essential Knowledge for R&D: How Much Current Can a PCB Trace Carry? Why “1 A per 1 mm” Is Not a Design Rule

“Is a 1 mm trace wide enough for 1 A?” This is a common PCB power-routing question, but it has no universally correct answer without defined operating conditions. A 1 mm trace made with 1 oz copper does not behave the same as one made with 2 oz copper. Its resistance, voltage drop, and temperature rise also change depending on whether it is on an external or internal layer and whether it is 10 mm or 100 mm long. PCB current-carrying capacity is therefore not a simple conversion between current and trace width. It is an electrical, thermal, and manufacturing problem.

8/23/2026

Course

Essential Knowledge for R&D: PCB Positive and Negative Artwork Are Not Two Fixed Etching Processes

PCB engineers frequently encounter the terms “positive” and “negative,” but these terms can describe different concepts across design software, CAM systems, and PCB fabricators. They may refer to Gerber image polarity, the light-and-dark relationship on a physical phototool, or the different imaging requirements of inner-layer print-and-etch and outer-layer pattern plating. Treating the subject as simply “positive for fine lines and negative for large copper areas” mixes image polarity, photoresist behavior, and the actual manufacturing route. The first questions should instead be: Which copper must remain? What photoresist is being used? Which areas remain after development? Is the next operation direct etching, or plating followed by etching?

8/21/2026

Course

CoWoS Is Scaling Toward 14 Reticle Sizes: What Should PCB and System Designers Watch?

As AI accelerators integrate more compute dies and high-bandwidth memory (HBM), advanced packages continue to grow in size. At its 2026 Technology Symposium, TSMC stated that it was producing CoWoS at 5.5 times reticle size and planned to begin production of a 14-reticle-size version in 2028. The architecture is expected to accommodate approximately ten large compute dies and twenty HBM stacks. Versions larger than 14 reticle sizes are planned for 2029. This development is about more than making the package larger. As a package becomes a complete computing system, PCB, power, thermal, and mechanical design must be coordinated earlier.

8/21/2026