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eCloud PCB, a Taiwan-based professional team, focuses on fast PCB prototyping and small-batch manufacturing. Backed by rich engineering experience, manufacturing resources and cloud tech, our engineer-oriented online platform supports instant upload, real-time quoting and order tracking for multi-layer boards, HDI and special processes, helping customers speed up R&D and product validation efficiently.

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Insights

Explore the latest trends in PCB design and manufacturing

Insights

Explore the latest trends in PCB design and manufacturing

Unveiling High-Speed PCB Materials: What Exactly Are M6 / M7 / M8 / M9? Why Are There No M1 to M5?

With the explosive growth of AI computing power and artificial intelligence, the PCB industry has officially entered the ultra-high-speed era. In the realms of AI servers, 800G/1.6T optical transceivers, and the impending rollout of 6G communications, the performance of PCB Copper Clad Laminates (CCL) directly determines the transmission quality of high-frequency signals. Today, when hardware engineers discuss high-speed materials, they are thoroughly accustomed to using shorthand terms like "M6, M7, M8, M9." What exactly is the meaning behind these product codes, which originated from the Japanese manufacturing giant Panasonic?

4/17/2026

Course

PCB Cost Analysis Series 8: Why Are PCB Prices Rising? Will They Continue to Rise? An In-Depth Analysis of AI-Driven Supply Chain Shifts and Future Trends

The recent wave of price hikes in the PCB industry is no longer merely a passive adjustment driven by rising costs of a single raw material; rather, it is the result of a four-pronged convergence of factors: “upstream material shortages, surging AI demand, product specification upgrades, and delays in high-end production capacity.” This article will provide an in-depth analysis of the core logic behind this price surge and the future risks involved, from the perspectives of both Taiwan’s supply chain and global original equipment manufacturers.

4/16/2026

Course

Three Major Classifications and the Inherent Process Challenges of Black and White Inks

Technical Column / PCB Manufacturing Processes In the Printed Circuit Board (PCB) manufacturing process, the Solder Mask application is like donning a custom-tailored "protective coat" over a precise electronic neural network. This process, often referred to in the industry as solder mask, green solder resist, or wet film, has a core mission: to accurately cover the copper surfaces and traces in non-soldering areas after the circuit layout is completed. This provides insulation protection, prevents short circuits during wave soldering, shields traces from oxidation, and enhances the board's aesthetic appearance. To fulfill this mission, the performance and process compatibility of the key material—Solder Mask Ink—directly determine the final reliability and quality limits of the PCB. This article will systematically analyze the technical classifications of solder mask inks and deeply explore the most challenging ones to process: white and black inks, revealing the physical and chemical root causes behind their complex parameter control.

4/15/2026

Course

DFM Practical Series 22: In-Depth Analysis of the POFV Process: The Art of “Cap Copper” in Precision PCB Manufacturing—How Should Copper Thickness Be Controlled?

In the field of high-end printed circuit board (PCB) manufacturing, the POFV (Plated Over Filled Via) process has become one of the key technologies for manufacturing high-density interconnect (HDI) boards. Commonly referred to in the industry as “cap copper,” this term vividly describes the process’s characteristic—much like carefully placing a “copper cap” on top of a resin-filled via. This technology not only resolves the issue of surface depression on traditional resin-filled vias but also provides a flat, reliable surface foundation for subsequent fine-line fabrication. It is an indispensable manufacturing process for today’s high-end electronic products, including servers, communication equipment, and aerospace applications.

4/14/2026

Course

Current News: Another Round of PCB Price Hikes! Industry Valuation Revaluation Driven by the Explosion in AI Computing Power

As April begins, reports of price hikes in the PCB industry have once again drawn market attention. Japan’s Mitsubishi Gas Chemical (MGC) officially announced a 30% price increase effective April 1 for its full range of high-end PCB materials, including copper-clad laminates (CCL) and prepregs (PP). This marks the third price hike by this international giant in the past six months. Meanwhile, major Taiwanese glass cloth manufacturers such as Fu Chiao and Chien Jung have also finalized their April price adjustment plans. The quoted price for 7628-grade electronic glass cloth has risen by nearly 10% compared to March, marking the fourth price hike for glass cloth this year. From the capital markets to the industrial sector, this wave of PCB price hikes has persisted for a full year. The cumulative increase across six rounds of price adjustments ranges from 47% to 65%, yet there are no signs of it abating. On the contrary, driven by the continued surge in demand for AI computing power, the trend appears to be accelerating.

4/13/2026

Course

Advanced Manufacturing Series 7: PCB Peel Strength and Adhesion—Why Are They Critical to the Success of Advanced Manufacturing Processes?

In the printed circuit board (PCB) supply chain, we often focus on line width and spacing, the number of layers, or surface treatments, yet we frequently overlook the core mechanical metrics that determine a PCB’s long-term reliability, durability, and overall yield: “peel strength” and “adhesion.” From the selection of copper-clad laminates (CCL) at the upstream stage to the shipment of finished PCBs at the downstream stage, these two metrics are absolutely critical for quality control throughout the entire process. In this technical column, we will delve into these two physical metrics that form the foundation of a PCB’s ability to withstand environmental stresses.

4/12/2026