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eCloud PCB, a Taiwan-based professional team, focuses on fast PCB prototyping and small-batch manufacturing. Backed by rich engineering experience, manufacturing resources and cloud tech, our engineer-oriented online platform supports instant upload, real-time quoting and order tracking for multi-layer boards, HDI and special processes, helping customers speed up R&D and product validation efficiently.

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Insights

Explore the latest trends in PCB design and manufacturing

Insights

Explore the latest trends in PCB design and manufacturing

PCB Manufacturing: A Deep Dive into the Causes and Solutions for PTH Voids (Copper Voids)

Where there is electricity, there are Printed Circuit Boards (PCBs). If you are just starting out in the industry and want to understand the failure mechanisms behind copper voids in plated through-holes (PTH), as well as how to fix them, you are in the right place. In PCB manufacturing, a lack of copper in the hole—commonly referred to as a PTH Void, Inner-layer Open, or Copper Void—is a highly common and critical quality defect. A "PTH Void" means that the inner wall of a via or component hole is partially or completely missing its copper plating. This directly leads to electrical open circuits or severely compromises the long-term reliability of the product. The Core Cause: At some point during the Electroless Copper (PTH) deposition or the Electroplating process, a complete, dense, and well-adhered copper layer failed to form on the hole wall. Let's break down this issue throughout the entire manufacturing process, exploring both the root causes and actionable countermeasures.

4/22/2026

Course

DFM Practical Case 24: PCB Manufacturing Inner Layer Patterning Process: How to Resolve Residual Copper Short Circuits?

The rapid iteration of AI computing power and consumer electronics is driving PCB manufacturing toward higher layer counts, High-Density Interconnects (HDI), and increasingly lighter, thinner, and smaller form factors. Consequently, inner layer trace levels have gradually scaled down from the conventional 100/100μm to 85/85, 75/75, 60/60, 50/50, and even 40/40μm, exponentially increasing both circuit complexity and manufacturing difficulty. Amidst these challenges, "inner layer residual copper short circuits" have emerged as a core pain point restricting yield rates. So, how can this be improved? In this article, we won't discuss anything else; we will focus solely on the issue of inner layer residual copper shorts. We will break down the process steps of inner layer pattern transfer in detail and, combined with on-site practical experience, propose specific, actionable improvement countermeasures to provide you with a clear direction and logic for improvement.

4/21/2026

Course

The True Bottleneck of AI Chips: TSMC’s CoWoS Capacity Crisis! NVIDIA Secures 50%, Leaving AMD and Broadcom in a Bidding War

The critical bottleneck for AI chips has shifted from "wafer fabrication" to "advanced packaging." TSMC’s CoWoS (Chip on Wafer on Substrate) capacity remains in severe shortage. While monthly capacity is projected to soar to 127,000 wafers by late 2026, NVIDIA has already swooped in to secure over 50% of the total output for the next two years. Faced with this massive supply gap, Tier-1 giants like AMD, Broadcom, and MediaTek are locked in a fierce bidding war. Consequently, TSMC plans to hike CoWoS quotes by 15%–20%, a move that will directly drive up the deployment costs of global AI infrastructure.

4/18/2026

Course

Unveiling High-Speed PCB Materials: What Exactly Are M6 / M7 / M8 / M9? Why Are There No M1 to M5?

With the explosive growth of AI computing power and artificial intelligence, the PCB industry has officially entered the ultra-high-speed era. In the realms of AI servers, 800G/1.6T optical transceivers, and the impending rollout of 6G communications, the performance of PCB Copper Clad Laminates (CCL) directly determines the transmission quality of high-frequency signals. Today, when hardware engineers discuss high-speed materials, they are thoroughly accustomed to using shorthand terms like "M6, M7, M8, M9." What exactly is the meaning behind these product codes, which originated from the Japanese manufacturing giant Panasonic?

4/17/2026

Course

PCB Cost Analysis Series 8: Why Are PCB Prices Rising? Will They Continue to Rise? An In-Depth Analysis of AI-Driven Supply Chain Shifts and Future Trends

The recent wave of price hikes in the PCB industry is no longer merely a passive adjustment driven by rising costs of a single raw material; rather, it is the result of a four-pronged convergence of factors: “upstream material shortages, surging AI demand, product specification upgrades, and delays in high-end production capacity.” This article will provide an in-depth analysis of the core logic behind this price surge and the future risks involved, from the perspectives of both Taiwan’s supply chain and global original equipment manufacturers.

4/16/2026

Course

Three Major Classifications and the Inherent Process Challenges of Black and White Inks

Technical Column / PCB Manufacturing Processes In the Printed Circuit Board (PCB) manufacturing process, the Solder Mask application is like donning a custom-tailored "protective coat" over a precise electronic neural network. This process, often referred to in the industry as solder mask, green solder resist, or wet film, has a core mission: to accurately cover the copper surfaces and traces in non-soldering areas after the circuit layout is completed. This provides insulation protection, prevents short circuits during wave soldering, shields traces from oxidation, and enhances the board's aesthetic appearance. To fulfill this mission, the performance and process compatibility of the key material—Solder Mask Ink—directly determine the final reliability and quality limits of the PCB. This article will systematically analyze the technical classifications of solder mask inks and deeply explore the most challenging ones to process: white and black inks, revealing the physical and chemical root causes behind their complex parameter control.

4/15/2026