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eCloud PCB, a Taiwan-based professional team, focuses on fast PCB prototyping and small-batch manufacturing. Backed by rich engineering experience, manufacturing resources and cloud tech, our engineer-oriented online platform supports instant upload, real-time quoting and order tracking for multi-layer boards, HDI and special processes, helping customers speed up R&D and product validation efficiently.

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Insights

Explore the latest trends in PCB design and manufacturing

Insights

Explore the latest trends in PCB design and manufacturing

DFM Practical Series 22: In-Depth Analysis of the POFV Process: The Art of “Cap Copper” in Precision PCB Manufacturing—How Should Copper Thickness Be Controlled?

In the field of high-end printed circuit board (PCB) manufacturing, the POFV (Plated Over Filled Via) process has become one of the key technologies for manufacturing high-density interconnect (HDI) boards. Commonly referred to in the industry as “cap copper,” this term vividly describes the process’s characteristic—much like carefully placing a “copper cap” on top of a resin-filled via. This technology not only resolves the issue of surface depression on traditional resin-filled vias but also provides a flat, reliable surface foundation for subsequent fine-line fabrication. It is an indispensable manufacturing process for today’s high-end electronic products, including servers, communication equipment, and aerospace applications.

4/14/2026

Course

Current News: Another Round of PCB Price Hikes! Industry Valuation Revaluation Driven by the Explosion in AI Computing Power

As April begins, reports of price hikes in the PCB industry have once again drawn market attention. Japan’s Mitsubishi Gas Chemical (MGC) officially announced a 30% price increase effective April 1 for its full range of high-end PCB materials, including copper-clad laminates (CCL) and prepregs (PP). This marks the third price hike by this international giant in the past six months. Meanwhile, major Taiwanese glass cloth manufacturers such as Fu Chiao and Chien Jung have also finalized their April price adjustment plans. The quoted price for 7628-grade electronic glass cloth has risen by nearly 10% compared to March, marking the fourth price hike for glass cloth this year. From the capital markets to the industrial sector, this wave of PCB price hikes has persisted for a full year. The cumulative increase across six rounds of price adjustments ranges from 47% to 65%, yet there are no signs of it abating. On the contrary, driven by the continued surge in demand for AI computing power, the trend appears to be accelerating.

4/13/2026

Course

Advanced Manufacturing Series 7: PCB Peel Strength and Adhesion—Why Are They Critical to the Success of Advanced Manufacturing Processes?

In the printed circuit board (PCB) supply chain, we often focus on line width and spacing, the number of layers, or surface treatments, yet we frequently overlook the core mechanical metrics that determine a PCB’s long-term reliability, durability, and overall yield: “peel strength” and “adhesion.” From the selection of copper-clad laminates (CCL) at the upstream stage to the shipment of finished PCBs at the downstream stage, these two metrics are absolutely critical for quality control throughout the entire process. In this technical column, we will delve into these two physical metrics that form the foundation of a PCB’s ability to withstand environmental stresses.

4/12/2026

Course

PCB Cost Analysis Series 7: How Much Do You Know About PCB Costs? A Practical DFM Guide to Cost Reduction That Every Hardware Engineer Should Read

The cost of a PCB is a complex, multifaceted system influenced by numerous factors, and manufacturing capabilities and pricing strategies vary among different PCB manufacturers. During the project development phase, if hardware engineers and procurement professionals can gain an early understanding of the cost structure, they can effectively control the budget without compromising product performance. This column will outline the key factors affecting PCB costs and share how design-stage optimization can lead to tangible cost savings.

4/11/2026

Course

DFM Practical Series 21: Essential PCB Stack-Up Design: What Do the Numbers 7628, 2116, and 1080 Actually Mean?

When reviewing the stack-up of a printed circuit board (PCB), we often see dielectric layers labeled as 7628, 2116, or 1080. To engineers or procurement personnel new to the PCB industry, these numbers may seem like a string of mysterious codes. Following up on our previous discussion about PCB surface treatments, today we turn our attention to the core dielectric material of PCBs—prepreg (commonly abbreviated as PP in the industry). Where do these numbers come from? What do they signify? And how should they be selected during design and manufacturing? This column will answer all these questions for you.

4/10/2026

Course

DFM Practical Guide 20: Getting DFM Right Starts with Choosing the Right Surface Finish: A Comprehensive Analysis of Chemical Gold Plating, Electrolytic Gold Plating, Nickel-Palladium Gold Plating, and Flash Gold Plating

Electroless nickel-gold (ENIG), electroplated gold, nickel-palladium-gold (ENEPIG), and flash gold are all types of surface treatment for PCBs. Although the names all include the word “gold,” they differ significantly in terms of process principles, metal layer structure, and application scenarios. In this week’s technical column, we’ll provide a detailed analysis of their differences.

4/9/2026