Insights

Advanced Process Technology Special Feature 2: Is 30/30μm No Longer Enough? Analyzing the Shift from HDI Limits to SLP System Benefits

When line width and spacing approach 30/30μm, the question is no longer “can it be done?” but rather— traditional HDI has reached its physical limits. As side etching begins to compromise impedance control, and as 5G and AI SoCs run out of escape routes for routing, Substrate-like PCB (SLP) is no longer an exclusive feature of flagship devices. It has become an inevitable choice for mid-to-high-end products. Recent hardware teardowns and supply chain dynamics reveal a major industry shift: high-end processes are rapidly trickling down. This paradigm shift, permeating from the pinnacle of the pyramid into the mainstream market, profoundly impacts the product layout decisions of every Project Manager (PM), procurement expert, and R&D Engineer (RD). We will uncover the underlying logic behind this technological shift through three manufacturing fault lines.